Nanoscale {\eta}-NiSi formation via ion irradiation of Si/Ni/Si
Nasrin Banu, Biswarup Satpati, Anjan Bhukta, B. N. Dev

TL;DR
This study demonstrates the formation of nanoscale {ta}-NiSi through ion irradiation of Si/Ni/Si layers, revealing unique oscillatory amorphization and recrystallization phenomena in silicon induced by ion beam mixing.
Contribution
It reports the first observation of oscillatory amorphization and recrystallization in silicon caused by ion irradiation, linked to Ni-induced effects, and details the formation of uniform {ta}-NiSi at nanoscale.
Findings
Recrystallized {ta}-NiSi layer formed at high ion fluence.
Oscillatory amorphization and recrystallization observed in silicon substrate.
Ni distribution influences silicon's phase transformations during irradiation.
Abstract
Nickel monosilicide (NiSi) has emerged as an excellent material of choice for source-drain contact applications below 45 nm node complementary metal-oxide-semiconductor (CMOS) technology. We have investigated the formation of nanoscale NiSi by ion irradiation of Si (~5 nm)/Ni(~15 nm)/Si, grown under ultrahigh vacuum environment. Irradiation was carried out at room temperature with 1 MeV Si+ ions. X-ray diffraction (XRD) and transmission electron microscopy (TEM) were employed for analysis. With increasing ion fluence ion beam mixing occurs and more and more Si is incorporated into the Ni layer and this layer gets amorphized. At an even higher fluence a recrystallized uniform nickel monosilicide ({\eta}-NiSi) layer is formed. Several planar spacings of different Miller indices of {\eta}-NiSi have been observed in XRD and TEM. Additionally, an oscillatory amorphization and…
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