A new model for temperature jump at a fluid-solid interface
Jian-Jun Shu, Ji Bin Melvin Teo, Weng Kong Chan

TL;DR
This paper introduces a novel analytical model for predicting the temperature jump at fluid-solid interfaces, applicable to both gases and liquids, based on interfacial adsorption interactions.
Contribution
The paper presents a unified analytical model for fluid-solid temperature jump that is validated against existing literature, filling a gap in accurate predictive models.
Findings
Model accurately predicts temperature jump for gases and liquids.
Validation shows good agreement with existing experimental and numerical data.
Provides a foundation for improved thermal interface design.
Abstract
The problem presented involves the development of a new analytical model for the general fluid-solid temperature jump. To the best of our knowledge, there are no analytical models that provide the accurate predictions of the temperature jump for both gas and liquid systems. In this paper, a unified model for the fluid-solid temperature jump has been developed based on our adsorption model of the interfacial interactions. Results obtained from this model are validated with available results from the literature.
Peer Reviews
No public reviews on file for this paper yet. If you reviewed it on a platform where reviews are public (OpenReview, ICLR, NeurIPS, ICML), you can paste yours below so the community can read it here.
Videos
No videos yet. Explain this paper in a talk, walkthrough, or lecture? Add one.
