The INFN-FBK Phase-2 R{\&}D Program
Gian-Franco Dalla Betta, Maurizio Boscardin, Marco Bomben, Mirko, Brianzi, Giovanni Calderini, Giovanni Darbo, Roberto Dell Orso, Andrea, Gaudiello, Gabriele Giacomini, Roberto Mendicino, Marco Meschini, Alberto, Messineo, Sabina Ronchin, D M S Sultan, Nicola Zorzi
TL;DR
This paper discusses a three-year research program focused on developing radiation-hard thin pixel detectors for the High Luminosity LHC upgrades, including sensor design, fabrication, and initial testing results.
Contribution
It presents new design and fabrication approaches for 3D and planar pixel sensors on 6-inch wafers, optimized for extreme radiation environments in collider experiments.
Findings
Successful fabrication of initial prototypes
Demonstrated radiation hardness up to 2e16 neq cm-2
Compatibility with current and future front-end chips
Abstract
We report on the 3-year INFN ATLAS-CMS joint research activity in collaboration with FBK, started in 2014, and aimed at the development of new thin pixel detectors for the High Luminosity LHC Phase-2 upgrades. The program is concerned with both 3D and planar active-edge pixel sensors to be made on 6-inch p-type wafers. The technology and the design will be optimized and qualified for extreme radiation hardness (2e16 neq cm-2). Pixel layouts compatible with present (for testing) and future (RD53 65nm) front-end chips of ATLAS and CMS are considered. The paper covers the main aspects of the research program, from the sensor design and fabrication technology, to the results of initial tests performed on the first prototypes.
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