Development of New 3D Pixel Sensors for Phase 2 Upgrades at LHC

TL;DR

This paper discusses the development and design of advanced 3D pixel sensors with enhanced radiation hardness and finer granularity for the HL-LHC upgrades, including simulations and fabrication details.

Contribution

It introduces new 3D pixel sensor designs optimized for high radiation environments and provides simulation and fabrication insights for these sensors.

Findings

Sensors designed for high radiation tolerance

Successful simulation of sensor performance

Fabrication of initial sensor prototypes

Abstract

We report on the development of new 3D pixel sensors for the Phase 2 Upgrades at the High-Luminosity LHC (HL-LHC). To cope with the requirements of increased pixel granularity (e.g., 50x50 or 25x100 um2 pixel size) and extreme radiation hardness (up to a fluence of 2e16 neq cm-2), thinner 3D sensors (~100 um) with electrodes having narrower size (~ 5 um) and reduced spacing (~ 30 um) are considered. The paper covers TCAD simulations, as well as technological and design aspects relevant to the first batch of these 3D sensors, that is currently being fabricated at FBK on 6-inch wafers.