Interfacial thermal conductance in graphene/black phosphorus heterogeneous structures
Yang Chen, Yingyan Zhang, Kun Cai, Jinwu Jiang, Jin-cheng Zheng,, Junhua Zhao, Ning Wei

TL;DR
This study investigates how interfacial thermal conductance in graphene/black phosphorus heterostructures can be enhanced through strain and defects, providing insights for improved heat dissipation in electronic devices.
Contribution
It demonstrates that external strain and interracial defects can significantly increase interfacial thermal conductance, offering a method for thermal management in heterostructure devices.
Findings
Compressive strain increases thermal conductance by an order of magnitude.
Interface defects double the interfacial thermal conductance.
Identified critical power thresholds for thermal stability.
Abstract
Graphene, as a passivation layer, can be used to protect the black phosphorus from the chemical reaction with surrounding oxygen and water. However, black phosphorus and graphene heterostructures have low efficiency of heat dissipation due to its intrinsic high thermal resistance at the interfaces. The accumulated energy from Joule heat has to be removed efficiently to avoid the malfunction of the devices. Therefore, it is of significance to investigate the interfacial thermal dissipation properties and manipulate the properties by interfacial engineering on demand. In this work, the interfacial thermal conductance between few-layer black phosphorus and graphene is studied extensively using molecular dynamics simulations. Two critical parameters, the critical power Pcr to maintain thermal stability and the maximum heat power density Pmax with which the system can be loaded, are…
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