A Big-Data Approach to Handle Many Process Variations: Tensor Recovery and Applications
Zheng Zhang, Tsui-Wei Weng, Luca Daniel

TL;DR
This paper introduces a tensor recovery-based high-dimensional uncertainty quantification method that significantly reduces computational complexity in modeling process variations in nano-scale integrated circuits, MEMS, and photonic devices.
Contribution
It presents a novel tensor recovery algorithm with sparse and low-rank constraints to efficiently handle over 50 random parameters, overcoming the curse of dimensionality.
Findings
Reduces simulation samples from billions to hundreds.
Successfully applied to ICs, MEMS, and photonic devices with many parameters.
Outperforms traditional stochastic collocation methods in high-dimensional settings.
Abstract
Fabrication process variations are a major source of yield degradation in the nano-scale design of integrated circuits (IC), microelectromechanical systems (MEMS) and photonic circuits. Stochastic spectral methods are a promising technique to quantify the uncertainties caused by process variations. Despite their superior efficiency over Monte Carlo for many design cases, these algorithms suffer from the curse of dimensionality; i.e., their computational cost grows very fast as the number of random parameters increases. In order to solve this challenging problem, this paper presents a high-dimensional uncertainty quantification algorithm from a big-data perspective. Specifically, we show that the huge number of (e.g., ) simulation samples in standard stochastic collocation can be reduced to a very small one (e.g., ) by exploiting some hidden structures of a…
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Taxonomy
TopicsProbabilistic and Robust Engineering Design · Low-power high-performance VLSI design · Tensor decomposition and applications
