3D sensors for the HL-LHC
D. V\'azquez Furelos, M. Carulla, E. Cavallaro, F. F\"orster, S., Grinstein, J. Lange, I. L\'opez Paz, M. Manna, G. Pellegrini, D. Quirion and, S. Terzo
TL;DR
This paper discusses the development of 3D pixel sensors as a promising technology for the upgraded inner tracking detector of the HL-LHC, aiming to withstand high radiation and particle rates.
Contribution
It presents recent advancements in 3D sensor technology tailored for the HL-LHC's demanding environment.
Findings
3D sensors exhibit excellent radiation hardness.
They operate effectively at low voltages and moderate temperatures.
Recent developments enhance their suitability for HL-LHC upgrades.
Abstract
In order to increase its discovery potential, the Large Hadron Collider (LHC) accelerator will be upgraded in the next decade. The high luminosity LHC (HL-LHC) period demands new sensor technologies to cope with increasing radiation fluences and particle rates. The ATLAS experiment will replace the entire inner tracking detector with a completely new silicon-only system. 3D pixel sensors are promising candidates for the innermost layers of the Pixel detector due to their excellent radiation hardness at low operation voltages and low power dissipation at moderate temperatures. Recent developments of 3D sensors for the HL-LHC are presented.
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