Thermal Transport Across Metal Silicide-Silicon Interfaces: An Experimental Comparison between Epitaxial and Non-epitaxial Interfaces
Ning Ye, Joseph P Feser, Sridhar Sadasivam, Timothy S. Fisher, Tianshi, Wang, Chaoying Ni, Anderson Janotti

TL;DR
This study compares the thermal interface conductance of various silicide-silicon interfaces, finding that epitaxy does not significantly affect conductance and evaluating the accuracy of computational models against experimental data.
Contribution
It provides the first comprehensive experimental comparison of epitaxial and non-epitaxial silicide/silicon interfaces and assesses the predictive accuracy of advanced computational models.
Findings
Epitaxial and non-epitaxial silicide/silicon interfaces show similar thermal conductance.
Carrier concentration has negligible effect on interface conductance.
Full-dispersion DMM accurately predicts temperature-dependent conductance for most interfaces.
Abstract
Silicides are used extensively in nano- and microdevices due to their low electrical resistivity, low contact resistance to silicon, and their process compatibility. In this work, the thermal interface conductance of TiSi, CoSi, NiSi and PtSi are studied using time-domain thermoreflectance. Exploiting the fact that most silicides formed on Si(111) substrates grow epitaxially, while most silicides on Si(100) do not, we study the effect of epitaxy, and show that for a wide variety of interfaces there is no difference in the thermal interface conductance of epitaxial and non-epitaxial silicide/silicon interfaces. The effect of substrate carrier concentration is also investigated over a wide range of p- and n-type doping, and is found to be independent of carrier concentration, regardless of whether the interface is epitaxial and regardless of silicide type. In the case of epitaxial…
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