Reactive magnetron sputter deposition of superconducting niobium titanium nitride thin films with different target sizes
B. G. C. Bos, D. J. Thoen, E. A. F. Haalebos, P. M. L. Gimbel, T. M., Klapwijk, J. J. A. Baselmans, A. Endo

TL;DR
This study compares two reactive sputter systems with different target sizes for depositing superconducting NbTiN thin films, focusing on maximizing Tc and understanding plasma characteristics to improve film uniformity for large-scale detector applications.
Contribution
It provides an experimental comparison of small and large target reactive sputtering systems, highlighting optimization strategies for high Tc and uniformity in NbTiN films.
Findings
Both systems achieved Tc > 15 K in deposited films.
Increasing pumping speed and gas flow improves film uniformity.
Using I-V characteristics effectively guides deposition optimization.
Abstract
The superconducting critical temperature (Tc > 15K) of niobium titanium nitride (NbTiN) thin films allows for low-loss circuits up to 1.1 THz, enabling on-chip spectroscopy and multi-pixel imaging with advanced detectors. The drive for large scale detector microchips is demanding NbTiN films with uniform properties over an increasingly larger area. This article provides an experimental comparison between two reactive d.c. sputter systems with different target sizes: a small target (100mm diameter) and a large target (127 mm x 444.5 mm). This article focuses on maximizing the Tc of the films and the accompanying I-V characteristics of the sputter plasma, and we find that both systems are capable of depositing films with Tc > 15 K. The resulting film uniformity is presented in a second manuscript in this volume. We find that these films are deposited within the transition from metallic to…
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