An upper limit on the lateral vacancy diffusion length in diamond
J. O. Orwa, K. Ganesan, J. Newnham, C. Santori, P. Barclay, K. M. C., Fu, R. G. Beausoleil, I. Aharonovich, B. A. Fairchild, P. Olivero, A. D., Greentree, S. Prawer

TL;DR
This study investigates the extent of vacancy diffusion in diamond after ion implantation, revealing that scattering effects, not diffusion, cause vacancies to appear far from mask edges, which is crucial for nano-device fabrication.
Contribution
The paper demonstrates that vacancy distribution beyond mask edges is primarily due to ion scattering rather than diffusion, providing a new understanding for precise diamond modification.
Findings
Scattering causes vacancy-like damage tens of micrometers from mask edges.
Diffusion of vacancies is limited to approximately 260 nm.
Scattering distances are much larger than diffusion estimates.
Abstract
Ion implantation is widely used to modify the structural, electrical and optical properties of materials. By appropriate masking, this technique can be used to define nano- and micro-structures. However, depending on the type of mask used, experiments have shown that vacancy-related substrate modification can be inferred tens of microns away from the edge of the mask used to define the implanted region. This could be due to fast diffusion of vacancies from the implanted area during annealing or to a geometric effect related to ion scattering around the mask edges. For quantum and single-atom devices, stray ion damage can be deleterious and must be minimized. In order to profile the distribution of implantation-induced damage, we have used the nitrogen-vacancy colour centre as a sensitive marker for vacancy concentration and distribution following MeV He ion implantation into diamond and…
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