Enabling Technologies for Silicon Microstrip Tracking Detectors at the HL-LHC

TL;DR

This paper reviews the collaborative efforts and technological advancements in silicon microstrip detectors developed by German groups for the high-luminosity upgrade of the LHC, focusing on radiation hardness, low mass design, and automated assembly.

Contribution

It presents the outcomes of a collaborative R&D project on silicon microstrip detector technologies for HL-LHC upgrades, highlighting shared expertise and innovations.

Findings

Enhanced radiation hardness of silicon sensors

Development of low mass detector components

Automated precision assembly procedures

Abstract

While the tracking detectors of the ATLAS and CMS experiments have shown excellent performance in Run 1 of LHC data taking, and are expected to continue to do so during LHC operation at design luminosity, both experiments will have to exchange their tracking systems when the LHC is upgraded to the high-luminosity LHC (HL-LHC) around the year 2024. The new tracking systems need to operate in an environment in which both the hit densities and the radiation damage will be about an order of magnitude higher than today. In addition, the new trackers need to contribute to the first level trigger in order to maintain a high data-taking efficiency for the interesting processes. Novel detector technologies have to be developed to meet these very challenging goals. The German groups active in the upgrades of the ATLAS and CMS tracking systems have formed a collaborative "Project on Enabling Technologies for Silicon Microstrip Tracking Detectors at the HL-LHC" (PETTL), which was supported by the Helmholtz Alliance "Physics at the Terascale" during the years 2013 and 2014. The aim of the project was to share experience and to work together on key areas of mutual interest during the R&D phase of these upgrades. The project concentrated on five areas, namely exchange of experience, radiation hardness of silicon sensors, low mass system design, automated precision assembly procedures, and irradiations. This report summarizes the main achievements.