Determining layer number of two dimensional flakes of transition-metal dichalcogenides by the Raman intensity from substrate
Xiao-Li Li, Xiao-Fen Qiao, Wen-Peng Han, Xin Zhang, Qing-Hai Tan, Tao, Chen, Ping-Heng Tan

TL;DR
This paper presents a Raman intensity-based method to accurately determine the layer number of ultrathin transition-metal dichalcogenide (TMD) flakes on substrates by fitting an effective refractive index, enabling better characterization of 2D materials.
Contribution
The study introduces an empirical effective refractive index model for ultrathin TMDs to identify layer number via substrate Raman intensity ratios, extending previous methods to ultrathin regimes.
Findings
Effective refractive index fitted for MoS₂, WS₂, and WSe₂.
Accurate layer number identification matching shear and breathing mode results.
Method applicable to various 2D materials and substrate configurations.
Abstract
Transition-metal dichalcogenide (TMD) semiconductors have been widely studied due to their distinctive electronic and optical properties. The property of TMD flakes is a function of its thickness, or layer number (N). How to determine N of ultrathin TMDs materials is of primary importance for fundamental study and practical applications. Raman mode intensity from substrates has been used to identify N of intrinsic and defective multilayer graphenes up to N=100. However, such analysis is not applicable for ultrathin TMD flakes due to the lack of a unified complex refractive index () from monolayer to bulk TMDs. Here, we discuss the N identification of TMD flakes on the SiO/Si substrate by the intensity ratio between the Si peak from 100-nm (or 89-nm) SiO/Si substrates underneath TMD flakes and that from bare SiO/Si substrates. We assume the real part of …
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