Understanding and Control of Bipolar Doping in Copper Nitride
Angela N Fioretti, Craig P Schwartz, John Vinson, Dennis Nordlund,, David Prendergast, Adele C Tamboli, Christopher M Caskey, Filip Tuomisto,, Florence Linez, Steven T Christensen, Eric S Toberer, Stephan Lany, and, Andriy Zakutayev

TL;DR
This study investigates the mechanisms behind bipolar doping in copper nitride (Cu3N), demonstrating control over conduction types through growth temperature and elucidating defect formation processes using experimental and theoretical methods.
Contribution
The paper provides a comprehensive understanding of bipolar doping in Cu3N by combining experimental measurements with defect theory, introducing a kinetic defect formation model for metastable semiconductors.
Findings
Demonstrated both n-type and p-type Cu3N via temperature-controlled growth.
Identified V_Cu and Cu_i defects as key to p-type and n-type doping, respectively.
Proposed a kinetic defect formation mechanism supported by experiments.
Abstract
Semiconductor materials that can be doped both n-type and p-type are desirable for diode-based applications and transistor technology. Copper nitride (Cu3N) is a metastable semiconductor with a solar-relevant bandgap that has been reported to exhibit bipolar doping behavior. However, deeper understanding and better control of the mechanism behind this behavior in Cu3N is currently lacking in the literature. In this work, we use combinatorial growth with a temperature gradient to demonstrate both conduction types of phase-pure, sputter-deposited Cu3N thin films. Room temperature Hall effect and Seebeck effect measurements show n-type Cu3N with 10^17 electrons/cm^3 for low growth temperature (~35 degrees C) and p-type with 10^15-10^16 holes/cm^3 for elevated growth temperatures (50-120 degrees C). Mobility for both types of Cu3N was ~0.1-1 cm^2/Vs. Additionally, temperature- dependent…
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