Accurate Measurements of Cross-plane Thermal Conductivity of Thin Films by Dual-Frequency Time-Domain Thermoreflectance (TDTR)

TL;DR

This paper introduces a dual-frequency TDTR method that significantly improves the accuracy of measuring cross-plane thermal conductivity in thin films, especially when traditional single-frequency methods face high uncertainty.

Contribution

The paper presents a novel dual-frequency TDTR technique that enhances measurement accuracy of thin film thermal conductivity by analyzing signal ratios at two modulation frequencies.

Findings

Achieved ~10% accuracy in measuring nickel-iron alloy and copper thin films.

Demonstrated the effectiveness of dual-frequency approach over traditional methods.

Improved sensitivity and reduced uncertainty in cross-plane thermal conductivity measurements.

Abstract

Accurate measurements of the cross-plane thermal conductivity {\Lambda}_cross of a high-thermal-conductivity thin film on a low-thermal-conductivity ({\Lambda}_s) substrate (e.g., {\Lambda}_cross/{\Lambda}_s>20) are challenging, due to the low thermal resistance of the thin film compared to that of the substrate. In principle, {\Lambda}_cross could be measured by time-domain thermoreflectance (TDTR), using a high modulation frequency f_h and a large laser spot size. However, with one TDTR measurement at f_h, the uncertainty of the TDTR measurement is usually high due to low sensitivity of TDTR signals to {\Lambda}_cross and high sensitivity to the thickness h_Al of Al transducer deposited on the sample for TDTR measurements. We observe that in most TDTR measurements, the sensitivity to h_Al only depends weakly on the modulation frequency f. Thus, we performed an additional TDTR measurement at a low modulation frequency f_0, such that the sensitivity to h_Al is comparable but the sensitivity to {\Lambda}cross is near zero. We then analyze the ratio of the TDTR signals at f_h to that at f_0, and thus significantly improve the accuracy of our {\Lambda}cross measurements. As a demonstration of the dual-frequency approach, we measured the cross-plane thermal conductivity of a 400-nm-thick nickel-iron alloy film and a 3-{\mu}m-thick Cu film, both with an accuracy of ~10%. The dual-frequency TDTR approach is useful for future studies of thin films.