Investigations on the energy balance in TDCB tests
Olaf Hesebeck, Udo Meyer, Andrea Sondag, Markus Brede

TL;DR
This paper investigates the energy dissipation mechanisms in TDCB tests for adhesives by combining finite element simulations with infrared thermography to better understand the sources of energy consumption during crack growth.
Contribution
It introduces two novel approaches—finite element modeling and infrared thermography—to analyze dissipation sources in mode I crack growth of adhesives in TDCB tests.
Findings
Finite element simulations differentiate plastic work from crack-related work.
Infrared thermography observes thermo-elastic effects and heat generation at the crack.
Combined methods estimate the energy balance in TDCB tests.
Abstract
The TDCB test is an established method to determine the critical strain energy release rate of adhesives in mode I. Provided that the adherends stay elastic, that the adhesive layer is not too flexible and that inertia effects can be neglected, the experiment allows to identify the work required by the adhesive layer per area of crack growth. The evaluation according to the standard does not permit to distinguish between different sources of dissipation in the adhesive layer or at the adhesive-adherend interfaces, though. This paper proposes two approaches to gain a more detailed understanding of the dissipation in mode I crack growth of adhesive layers. The first investigation method uses detailed finite element simulations of the TDCB test based on an elastic-plastic adhesive material model derived from tests on bulk specimens. The simulation is used to distinct between the work…
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