Superior bit error rate and jitter due to improved switching field distribution in exchange spring magnetic recording
Dieter Suess, Markus Fuger, Claas Abert, Florian Bruckner, Roman, Windl, Pietro Palmesi, Anton Buder, Christoph Vogler

TL;DR
This paper demonstrates that exchange spring magnetic media exhibit significantly reduced switching field distribution and jitter, leading to lower bit error rates, due to improved thermal stability and exchange coupling effects.
Contribution
It introduces a novel mechanism for reducing switching field distribution and shows how exchange spring media improve thermal stability and jitter performance over single-phase media.
Findings
Switching field distribution reduced by about 30%
Thermal stability leads to decreased transition jitter
Estimated jitter comparable to optimized heat-assisted media
Abstract
We report two effects that lead to a reduction of the switching field distribution in exchange spring media. The first effect relies on a subtle mechanism of the interplay between exchange coupling between soft and hard layers and anisotropy that allows significant reduction of the switching field distribution in exchange spring media. This effect reduces the switching field distribution by about 30% compared to single-phase media. A second effect is that due to the improved thermal stability of exchange spring media over single-phase media, thermal fluctuation leads to reduced fundamental transition jitter. The influence of this overall improved switching field distribution on the transition jitter in granular recording and the bit error rate in bit-patterned magnetic recording is discussed. The transition jitter in granular recording for a distribution of K1 values of 3% in the hard…
Peer Reviews
No public reviews on file for this paper yet. If you reviewed it on a platform where reviews are public (OpenReview, ICLR, NeurIPS, ICML), you can paste yours below so the community can read it here.
Videos
No videos yet. Explain this paper in a talk, walkthrough, or lecture? Add one.
Taxonomy
TopicsMagnetic properties of thin films · Adhesion, Friction, and Surface Interactions · Copper Interconnects and Reliability
