The thermal stability and separation characteristic of anti-sticking layers of Pt/Cr films for hot slumping technology

TL;DR

This study investigates the thermal stability and separation properties of Pt/Cr films used as anti-sticking layers in hot slumping, identifying the optimal Cr/Pt ratio for improved performance.

Contribution

It introduces a comparative analysis of different Pt/Cr film compositions, highlighting the superior stability of 2.5 nm Cr+50 nm Pt layers for hot slumping applications.

Findings

2.5 nm Cr+50 nm Pt films show the best thermal stability.

Optimal anti-sticking performance achieved with 2.5 nm Cr+50 nm Pt.

Enhanced maximum temperature in hot slumping using these films.

Abstract

The thermal stability and separation characteristic of anti-sticking layers of Pt/Cr films were studied in this paper. Several types of adhesion layers were investigated: 10.0 nm Pt, 1.5 nm Cr+50.0 nm Pt, 2.5 nm Cr+50.0 nm Pt and 3.5 nm Cr+50.0 nm Pt fabricated using direct current magnetron sputtering. The variation of layer thicknesses, roughness, crystallization and surface topography of Pt/Cr films have been analyzed by grazing incidence X-ray reflectometry, large angle X-ray diffraction and the optical profiler before and after heating. 2.5 nm Cr+50.0 nm Pt films exhibit the best thermal stability and separation characteristic according to the heating and hot slumping experiments. The films were also applied as anti-sticking layers to optimize the maximum temperature of hot slumping technology.