Substrate effects and diffusion dominated roughening in Cu2O electrodeposition
I. S. Brandt, V. C. Zoldan, V. Stenger, C. C. Pla Cid, A. A. Pasa, T., J. Oliveira, F. D. A. Aarao Reis

TL;DR
This study investigates how substrate choice influences the structure, morphology, and surface roughening in Cu2O electrodeposited films, revealing diffusion-driven surface dynamics and substrate-dependent coarsening effects.
Contribution
It demonstrates that substrate material affects Cu2O film morphology and roughening behavior, with surface dynamics governed by diffusion processes described by the Mullins-Herring equation.
Findings
Surface morphology varies with substrate type.
Diffusion dominates surface roughening in both systems.
Coarsening effects depend on initial grain size distribution.
Abstract
Cuprous oxide (Cu2O) films from 25 nm to 1500 nm were electrodeposited on n-Si(100) and Ni/n-Si(100) substrates from aqueous solution at room temperature. X-ray diffraction and transmission electron microscopy imaging show that the Cu2O structure and morphology is strongly affected by the substrate choice, with V shape and U shape columnar growth on n-Si(100) and Ni/n-Si(100), respectively. Atomic force microscopy reveals the presence of rounded grains at the surface in both cases. Anomalous and normal roughening are observed in films grown on n-Si and Ni, respectively, but estimates of scaling exponents are not conclusive. On the other hand, the distributions of local heights, roughness, and extremal heights show good agreement with those of the fourth order linear stochastic equation of Mullins and Herring (MH). Thus, surface dynamics in both systems is dominated by diffusion of…
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