Precision measurement of the carrier drift velocities in <100> silicon
C. Scharf, R. Klanner

TL;DR
This study provides precise measurements of electron and hole drift velocities in high-purity <100> silicon across various electric fields and temperatures, introducing improved models and methods for accurate characterization.
Contribution
It introduces a new mobility parametrization and extends the classical time-of-flight method to non-uniform fields, enhancing drift velocity measurement accuracy.
Findings
Achieved about 1% agreement between two measurement methods.
Extended drift velocity parameterizations to fields up to 50 kV/cm and temperatures 233-333 K.
Provided precise data for high-purity <100> silicon's charge carrier mobilities.
Abstract
Measurements of the drift velocities of electrons and holes as functions of electric field and temperature in high-purity n- and p-type silicon with <100> crystal orientation are presented. The measurements cover electric field values between 2.4 and 50 kV/cm and temperatures between 233 and 333 K. Two methods have been used for extracting the drift velocities from current transient measurements: A time-of-flight (tof) method and fits of simulated transients to the measured transients, with the parameters describing the field and temperature dependence of the electron and hole mobilities as free parameters. A new mobility parametrization, which also provides a better description of existing data than previous ones, allowed an extension of the classical tof method to the situation of non-uniform fields. For the fit method, the use of the convolution theorem of Fourier transforms enabled…
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