INFN Camera demonstrator for the Cherenkov Telescope Array

TL;DR

This paper presents the development and testing of a silicon photomultiplier-based camera demonstrator for the Cherenkov Telescope Array, aiming to cover high-energy gamma-ray observations with improved resolution and sensitivity.

Contribution

It introduces a novel compact camera demonstrator with SiPMs and advanced electronics, tailored for the CTA's high-energy telescope design.

Findings

Successful integration of SiPMs with Target 7 ASIC electronics

Effective thermal management with water cooling system

Demonstrated camera performance meets design specifications

Abstract

The Cherenkov Telescope Array is a world-wide project for a new generation of ground-based Cherenkov telescopes of the Imaging class with the aim of exploring the highest energy region of the electromagnetic spectrum. With two planned arrays, one for each hemisphere, it will guarantee a good sky coverage in the energy range from a few tens of GeV to hundreds of TeV, with improved angular resolution and a sensitivity in the TeV energy region better by one order of magnitude than the currently operating arrays. In order to cover this wide energy range, three different telescope types are envisaged, with different mirror sizes and focal plane features. In particular, for the highest energies a possible design is a dual-mirror Schwarzschild-Couder optical scheme, with a compact focal plane. A silicon photomultiplier (SiPM) based camera is being proposed as a solution to match the dimensions of the pixel (angular size of ~ 0.17 degrees). INFN is developing a camera demonstrator made by 9 Photo Sensor Modules (PSMs, 64 pixels each, with total coverage 1/4 of the focal plane) equipped with FBK (Fondazione Bruno Kessler, Italy) Near UltraViolet High Fill factor SiPMs and Front-End Electronics (FEE) based on a Target 7 ASIC, a 16 channels fast sampler (up to 2GS/s) with deep buffer, self-trigger and on-demand digitization capabilities specifically developed for this purpose. The pixel dimensions of $6\times6$ mm$^2$ lead to a very compact design with challenging problems of thermal dissipation. A modular structure, made by copper frames hosting one PSM and the corresponding FEE, has been conceived, with a water cooling system to keep the required working temperature. The actual design, the adopted technical solutions and the achieved results for this demonstrator are presented and discussed.