Inverse determination of effective mechanical properties of adhesive bondlines

TL;DR

This paper introduces a combined experimental and numerical modal analysis method to inversely determine the effective mechanical properties of adhesive bondlines, validated on spruce wood with promising results.

Contribution

It presents a novel inverse approach using modal analysis and finite element modeling to accurately estimate bondline properties in wood-adhesive systems.

Findings

Effective bondline properties can be determined from eigenfrequency shifts.

The method yields results within reasonable ranges for wood and adhesive.

Potential for non-destructive evaluation of adhesive properties.

Abstract

A new approach for determining effective mechanical bondline properties using a combined experimental-numerical modal analysis technique is proposed. After characterizing clear spruce wood boards, an adhesive layer is applied to the boards surfaces. The shift of the eigenfrequencies resulting from the adhesive layer together with information on the bondline geometry can then be used to inversely determine the mechanical properties of the adhesive layer using Finite Element Models. The calculated values for clear wood as well as for the adhesive layer lie within reasonable ranges, thus demonstrating the methods potential.