Long-term stability of Cu surface nanotips
Ville Jansson, Ekaterina Baibuz, Flyura Djurabekova

TL;DR
This study uses a kinetic Monte Carlo model to analyze the stability and lifetime of copper surface nanotips at various temperatures, revealing their dependence on crystallographic orientation and temperature, with implications for high voltage electronics.
Contribution
The paper introduces a validated KMC model for simulating surface diffusion on copper nanotips, demonstrating its efficiency and accuracy compared to MD simulations.
Findings
Tall nanotips are stable at room temperature but flatten quickly near melting point.
Nanotips along <110> directions are more stable than <100> or <111>.
KMC simulations are significantly faster than MD and accurately predict surface flattening.
Abstract
Sharp nanoscale tips on metal surfaces of electrodes enhance locally applied electric fields. Strongly enhanced electric fields trigger electron field emission and atom evaporation from the apexes of the nanotips. Combined together, these processes may explain electric discharges in form of small local arcs observed near metal surfaces in the presence of electric fields even in ultra high vacuum conditions. In the present work we investigate the stability of nanoscale tips by means of computer simulations of surface diffusion processes on copper (Cu), the main material of high voltage electronics. We study the stability and life-time of thin Cu surface nanotips at different temperatures in terms of diffusion processes. For this purpose, we have developed a surface Kinetic Monte Carlo (KMC) model where the jump processes are described by tabulated precalculated energy barriers. We show…
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