Alternative glues for the production of ATLAS silicon strip modules for the Phase-II upgrade of the ATLAS Inner Detector

TL;DR

This study evaluates six UV cure glues and a glue pad as alternatives to silver epoxy for assembling silicon strip detector modules in the ATLAS Phase-II upgrade, focusing on their mechanical, thermal, and radiation properties.

Contribution

It identifies three UV cure glues as promising alternatives to silver epoxy for detector module assembly, with comprehensive testing results.

Findings

Three UV cure glues were excluded due to poor properties.

Three UV cure glues showed potential as better alternatives.

Electrical tests on prototypes demonstrated feasibility.

Abstract

The Phase-II upgrade of the ATLAS detector for the High Luminosity Large Hadron Collider (HL-LHC) includes the replacement of the current Inner Detector with an all-silicon tracker consisting of pixel and strip detectors. The current Phase-II detector layout requires the construction of 20,000 strip detector modules consisting of sensor, circuit boards and readout chips, which are connected mechanically using adhesives. The adhesive between readout chips and circuit board is a silver epoxy glue as was used in the current ATLAS SemiConductor Tracker (SCT). This glue has several disadvantages, which motivated the search for an alternative. This paper presents a study concerning the use of six ultra-violet (UV) cure glues and a glue pad for use in the assembly of silicon strip detector modules for the ATLAS upgrade. Trials were carried out to determine the ease of use, the thermal conduction and shear strength, thermal cycling, radiation hardness, corrosion resistance and shear strength tests. These investigations led to the exclusion of three UV cure glues as well as the glue pad. Three UV cure glues were found to be possible better alternatives. Results from electrical tests of first prototype modules constructed using these glues are presented.