The role of low-energy phonons with mean-free-paths >0.8 um in heat conduction in silicon
Puqing Jiang, Yee Kan Koh

TL;DR
This study accurately measures the contribution of low-energy phonons with long mean-free-paths to heat conduction in silicon, revealing discrepancies with prior first-principles predictions and highlighting the role of macroscopic damping effects.
Contribution
The paper provides the first precise measurements of phonon MFP contributions in silicon over a wide temperature range, and suggests that macroscopic damping explains discrepancies with previous calculations.
Findings
Phonons with MFP >0.8 um contribute 37% to heat conduction at 300 K.
Phonons with MFP >3 um contribute 61% at 100 K.
Macroscopic damping eliminates contributions of phonons with MFP >30 um at 300 K.
Abstract
Despite recent progress in the first-principles calculations and measurements of phonon mean-free-paths (MFPs), contribution of low-energy phonons to heat conduction in silicon is still inconclusive, as exemplified by the discrepancies between different first-principles calculations. Here we investigate the contribution of low-energy phonons with MFP>0.8 um by accurately measuring the cross-plane thermal conductivity of crystalline silicon films by time-domain thermoreflectance (TDTR), over a wide range of film thickness 1-10 um and temperature 100-300 K. We employ a dual-frequency TDTR approach to improve the accuracy of our cross-plane thermal conductivity measurements. We find from our cross-plane thermal conductivity measurements that phonons with MFP>0.8 um contribute 53 W/m-K (37%) to heat conduction in Si at 300 K while phonons with MFP>3 um contribute 523 W/m-K (61%) at 100 K,…
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