Simultaneous Multi Layer Access: A High Bandwidth and Low Cost 3D-Stacked Memory Interface
Donghyuk Lee, Gennady Pekhimenko, Samira Khan, Saugata Ghose, Onur, Mutlu

TL;DR
This paper introduces SMLA, a novel architecture that enhances 3D-stacked DRAM bandwidth by simultaneously accessing multiple layers through existing global bitlines, achieving higher throughput without additional cost.
Contribution
The paper proposes SMLA, a new multi-layer access method that aggregates internal bandwidth and operates at higher IO frequencies, significantly improving performance and energy efficiency.
Findings
SMLA achieves 4x bandwidth increase for four-layer DRAM.
SMLA reduces energy consumption by 18%.
SMLA improves multi-programmed workload performance by 55%.
Abstract
Limited memory bandwidth is a critical bottleneck in modern systems. 3D-stacked DRAM enables higher bandwidth by leveraging wider Through-Silicon-Via (TSV) channels, but today's systems cannot fully exploit them due to the limited internal bandwidth of DRAM. DRAM reads a whole row simultaneously from the cell array to a row buffer, but can transfer only a fraction of the data from the row buffer to peripheral IO circuit, through a limited and expensive set of wires referred to as global bitlines. In presence of wider memory channels, the major bottleneck becomes the limited data transfer capacity through these global bitlines. Our goal in this work is to enable higher bandwidth in 3D-stacked DRAM without the increased cost of adding more global bitlines. We instead exploit otherwise-idle resources, such as global bitlines, already existing within the multiple DRAM layers by accessing…
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Taxonomy
TopicsParallel Computing and Optimization Techniques · Advanced Data Storage Technologies · Interconnection Networks and Systems
