A robust platform cooled by superconducting electronic refrigerators
Hung Q. Nguyen, Matthias Meschke, Jukka P. Pekola

TL;DR
This paper presents a robust cooling platform using superconducting electronic refrigerators integrated with a silicon nitride membrane, achieving significant cooling from 305 mK to 200 mK for practical applications.
Contribution
The authors successfully integrated a high-performance superconducting cooler with a dielectric membrane, creating a durable and versatile cooling platform for various uses.
Findings
Cooling from 305 mK to 200 mK achieved
Integration with silicon nitride membrane demonstrated
Platform is robust and suitable for multiple applications
Abstract
A biased tunnel junction between a superconductor and a normal metal can cool the latter electrode. Based on a recently developed cooler with high power and superior performance, we have successfully integrated it with a dielectric silicon nitride membrane, and cooled phonons from 305 mK down to 200 mK. Without perforation and covered under a thin alumina layer, the membrane is rigorously transformed into a cooling platform that is robust and versatile for multiple practical purposes. We discuss our results and possibilities to further improve the device.
Peer Reviews
No public reviews on file for this paper yet. If you reviewed it on a platform where reviews are public (OpenReview, ICLR, NeurIPS, ICML), you can paste yours below so the community can read it here.
Videos
No videos yet. Explain this paper in a talk, walkthrough, or lecture? Add one.
