Effect of thermal and cryogenic conditioning on flexural behavior of thermally shocked Cu-Al2O3 micro- and nano-composites
Khushbu Dash, Sujata Panda, Bankim Chandra Ray

TL;DR
This study investigates how thermal and cryogenic treatments affect the flexural strength of Cu-Al2O3 micro- and nanocomposites, revealing that thermal shocks can enhance or weaken their mechanical properties depending on conditions.
Contribution
It provides new insights into the effects of thermal shock cycles and high-temperature environments on the flexural behavior of copper-alumina composites at micro and nano scales.
Findings
Flexural strength increased after thermal shock treatments.
High-temperature flexural strength decreased compared to ambient conditions.
Thermal stresses influence particle/matrix interface integrity.
Abstract
This investigation has used flexural test to explore the effects of thermal treatments, i.e., high-temperature and cryogenic environments on the mechanical property of alumina particulate-reinforced Cu metal matrix micro and nanocomposites in ex-situ and in-situ conditions. Cu-5 vol. pct alumina micro (10 micron)- and nanocomposites (<50 nm) fabricated by powder metallurgy route were subjected to up-thermal shock cycle [193 K to 353 K (-80C to 80C)] and down-thermal shock cycle [193 K to 353 K (from 80C to -80C)] for different time periods followed by 3-point bend test. One batch of specimens (micro and nanocomposites) was conditioned at [193 K to 353 K (from 80C to -80C)] separately followed by 3-point flexural test. High-temperature flexural test was performed at [373 K to 523 K (100C to 250C)] on the micro and nanocomposites. All the fractured samples obtained after various thermal…
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