A coupled cohesive zone model for transient analysis of thermoelastic interface debonding

TL;DR

This paper introduces a coupled cohesive zone model that simulates thermoelastic interface debonding under transient thermal and mechanical loads, incorporating a variable interface conductivity to capture partial decohesion effects.

Contribution

It presents a novel coupled model linking fracture mechanics and contact mechanics, with a variable interface conductivity, and applies it to transient thermoelastic analysis of interface debonding.

Findings

The model predicts the time evolution of displacement and temperature fields during debonding.

Numerical implementation uses an implicit scheme for stability and accuracy.

Application to photovoltaics demonstrates the model's capability in real-world scenarios.

Abstract

A coupled cohesive zone model based on an analogy between fracture and contact mechanics is proposed to investigate debonding phenomena at imperfect interfaces due to thermomechanical loading and thermal fields in bodies with cohesive cracks. Traction-displacement and heat flux-temperature relations are theoretically derived and numerically implemented in the finite element method. In the proposed formulation, the interface conductivity is a function of the normal gap, generalizing the Kapitza constant resistance model to partial decohesion effects. The case of a centered interface in a bimaterial component subjected to thermal loads is used as a test problem. The analysis focuses on the time evolution of the displacement and temperature fields during the transient regime before debonding, an issue not yet investigated in the literature. The solution of the nonlinear numerical problem is gained via an implicit scheme both in space and in time. The proposed model is finally applied to a case study in photovoltaics where the evolution of the thermoelastic fields inside a defective solar cell is predicted.