"Quick and dirty" technology for fabrication of a single BiSrCaCuO mesas

TL;DR

This paper presents a rapid, controllable wet etching method for fabricating thicker BiSrCaCuO mesas, offering a faster alternative to ion milling with comparable quality, demonstrated through Josephson effect measurements.

Contribution

It introduces a simple wet etching technique for BiSrCaCuO mesas that is faster and allows for thicker structures than traditional ion milling methods.

Findings

Mesas can be fabricated much thicker than usual.

Fabrication time is significantly reduced.

Josephson characteristics confirmed in the produced mesas.

Abstract

The technology of wet etching allowing fabrication of standalone BiSrCaCuO mesa structures was proposed. The produced mesas can be produced much thicker than ones usually being studied. The time required for the fabrication is much smaller in comparison with the standard method of ion milling. The process used is controllable which provides acceptable precision of mesa fabrication. The current-voltage characteristics of the sample showing Josephson nature were obtained. The qualitative comparison with characteristics of similar structures fabricated by other groups was carried out.