Origin of defects responsible for charge transport in resistive random access memory based on hafnia
Damir R. Islamov (1), T. V. Perevalov (1), V. A. Gritsenkov, V. Sh., Aliev (1), A. A. Saraev (2), V. V. Kaichev (2), E. V. Ivanova (3), M. V., Zamoryanskaya (3), C. H. Cheng (4), Albert Chin (5) ((1) A.V. Rzhanov, Institute of Semiconductor Physics of SB RAS, Novosibirsk, Russia

TL;DR
This paper investigates the charge transport mechanisms in hafnia-based ReRAM, identifying oxygen vacancies as key defects responsible for high-resistance state conduction and modeling the low-resistance state via percolation theory.
Contribution
It provides experimental and theoretical evidence that oxygen vacancies govern charge transport in hafnia ReRAM, with a detailed model matching current-voltage data.
Findings
Oxygen vacancies are responsible for HRS charge transport.
LRS transport occurs via percolation mechanism.
Quantitative agreement between model and experimental data achieved.
Abstract
A promising candidate for universal memory, which would involve combining the most favourable properties of both high-speed dynamic random access memory (DRAM) and non-volatile flash memory, is resistive random access memory (ReRAM). ReRAM is based on switching back and forth from a high-resistance state (HRS) to a low-resistance state (LRS). ReRAM cells are small, allowing for the creation of memory on the scale of terabits. One of the most promising materials for use as the active medium in resistive memory is hafnia (HfO). However, an unresolved physics is the nature of defects and traps that are responsible for the charge transport in HRS state of resistive memory. In this study, we demonstrated experimentally and theoretically that oxygen vacancies are responsible for the HRS charge transport in resistive memory elements based on HfO. We also demonstrated that LRS…
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Taxonomy
TopicsAdvanced Memory and Neural Computing · Semiconductor materials and devices · Ferroelectric and Negative Capacitance Devices
