Vacuum nanogap formation in multilayer structures by an adhesion-controlled process
Z. Taliashvili, A. Tavkhelidze, L. Jangidze, Y. Blagidze

TL;DR
This paper presents a controlled adhesion process to create large-area vacuum nanogaps in multilayer metal structures, enabling applications in energy conversion and cooling.
Contribution
We developed a method to precisely regulate adhesion between metal films to produce large-area vacuum nanogaps with sub-5 nm separation.
Findings
Successfully fabricated nanogaps smaller than 5 nm over 7 mm² areas.
Controlled adhesion and thermal processes enable reproducible separation.
Electrodes produced are suitable for thermionic and thermotunneling applications.
Abstract
In this study, we regulate adhesion between thin metal films to produce a large-area vacuum nanogap for electron tunneling. Multilayer structures comprising thin metal films with adjustable adhesion were fabricated. The Cu/Ag/Ti/Si structures were grown on Si substrates and include thin Ti and Ag films and a thick Cu layer. The Ag and Ti films were deposited on the Si substrate under vacuum, and a thick Cu layer was subsequently electroplated onto the Ag surface. Later, the sandwich was separated and a vacuum nanogap was opened to produce two Ag/Cu and Ti/Si conformal electrodes. The adhesion strength between the Ti and Ag films was precisely adjusted by exposing the structures to dry O2 after Ti growth but before Ag growth. The resulting adhesion needed to be sufficiently high to allow electroplating of Cu and sufficiently low to allow subsequent separation. Either heating or cooling…
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