Airtight metallic sealing at room temperature under small mechanical pressure

TL;DR

This paper presents a room-temperature metallic sealing process using silver nanorods under small mechanical pressure, achieving low leak rates and high shear strength suitable for organic electronics.

Contribution

The study introduces a novel room-temperature metallic sealing method with nanorods, achieving high mechanical strength and low leak rates in ambient conditions.

Findings

Leak rate of 1.1 x 10^-3 cm^3 atm/m^2/day

Shear strength higher than 8.9 MPa

Effective sealing for organic electronic devices

Abstract

Here, we report a process of metallic sealing using small well-separated Ag nanorods; the process is at room temperature under a small mechanical pressure of 9.0 MPa, and also in ambient. The metallic seals have an air leak rate of 1.1 x 10-3 cm3atm/m2/day, and mechanical shear strength higher than 8.9 MPa. This leak rate meets the requirement of organic solar cells and organic light emitting diodes [1].