3D Technologies for Large Area Trackers

TL;DR

This paper discusses the development of wafer-scale 3D electronics and sensor technologies for creating large, low-cost, pixelated tracking detectors with high yield, minimal dead area, and improved electrical performance.

Contribution

It introduces a novel approach to large area trackers using wafer-scale 3D integration, enabling fully active sensor/readout tiles with better performance and manufacturability.

Findings

Potential for large area, low-cost detector production

Enhanced electrical performance through through-bulk connections

High-yield assembly of active sensor tiles

Abstract

We describe technologies which can be developed to produce large area, low cost pixelated tracking detec- tors. These utilize wafer-scale 3D electronics and sensor technologies currently being developed in industry. This can result in fully active sensor/readout chip tiles which can be assembled into large area arrays with good yield and minimal dead area. The ability to connect though the bulk of the device can also provide better electrical performance and lower mass.