First-Principles Calculation of Thermal Transport in the Metal/Graphene System
R. Mao, B. D. Kong, C. Gong, S. Xu, T. Jayasekera, K. Cho, K. W. Kim

TL;DR
This study uses first-principles phonon transport modeling to analyze how different metal/graphene interfaces affect thermal transfer, revealing that bonding strength and interfacial microstructure critically influence thermal resistance.
Contribution
It provides a detailed atomistic analysis of thermal transport in various metal/graphene interfaces using first-principles calculations and Landauer formalism, highlighting the role of bonding nature.
Findings
Chemisorbed interfaces have lower thermal resistance than physisorbed.
Pd/Gr interface exhibits unusually high thermal resistance due to mixed bonding.
Good agreement with experimental data supports the model's validity.
Abstract
Thermal properties in the metal/graphene (Gr) systems are analyzed by using an atomistic phonon transport model based on Landauer formalism and first-principles calculations. The specific structures under investigation include chemisorbed Ni(111)/Gr, physisorbed Cu(111)/Gr and Au(111)/Gr, as well as Pd(111)/Gr with intermediate characteristics. Calculated results illustrate a strong dependence of thermal transfer on the details of interfacial microstructures. In particular, it is shown that the chemisorbed case provides a generally smaller interfacial thermal resistance than the physisorbed due to the stronger bonding. However, our calculation also indicates that the weakly chemisorbed interface of Pd/Gr may be an exception, with the largest thermal resistance among the considered. Further examination of the electrostatic potential and interatomic force constants reveal that the mixed…
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