How to reduce the crack density in drying colloidal material?
Fran\c{c}ois Boulogne, Fr\'ed\'erique Giorgiutti-Dauphin\'e and, Ludovic Pauchard

TL;DR
This paper investigates how drying rate, solvent type, and particle properties influence crack formation in drying colloidal films, aiming to identify methods to reduce crack density for better material integrity.
Contribution
It provides experimental evidence linking drying conditions and material properties to crack density, offering insights for controlling cracks in colloidal drying processes.
Findings
Crack density depends on drying rate and solvent nature.
Mechanical properties of colloidal particles influence crack formation.
Faster drying increases crack density.
Abstract
The drying of a colloidal dispersion can result in a gel phase defined as a porous matrix saturated in solvent. During the drying process, high mechanical stresses are generated. When these stresses exceed the strength of the material, they can be released in the formation of cracks. This process strongly depends on both the mechanical properties of the material and the way the gel consolidates. In this report, we give experimental evidences that the number of cracks formed in the consolidating film depend on the drying rate, the nature of the solvent and the mechanical properties of the colloidal particles.
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Taxonomy
TopicsNanomaterials and Printing Technologies · Microencapsulation and Drying Processes · Fluid Dynamics and Heat Transfer
