Digging up bulk band dispersion buried under a passivation layer
Masaki Kobayashi, Iriya Muneta, Thorsten Schmitt, Luc Patthey, Shinobu, Ohya, Masaaki Tanaka, Masaharu Oshima, Vladimir N. Strocov

TL;DR
This paper demonstrates that soft X-ray ARPES can effectively reveal the bulk electronic band structure of buried thin films through passivation layers, overcoming surface sensitivity limitations of traditional methods.
Contribution
It introduces a novel SX-ARPES technique to probe the electronic structure of protected thin films without surface cleaning, expanding capabilities for heterostructure analysis.
Findings
Bulk band dispersion observed through amorphous capping layer
SX-ARPES extends probing depth into buried layers
Method avoids surface contamination issues
Abstract
Atomically controlled crystal growth of thin films has established foundations of nanotechnology aimed at the development of advanced functional devices. Crystallization under non-equilibrium conditions allows engineering of new materials with their atomically-flat interfaces in the heterostructures exhibiting novel physical properties. From a fundamental point of view, knowledge of the electronic structures of thin films and their interfaces is indispensable to understand the origins of their functionality which further evolves into realistic device application. In view of extreme surface sensitivity of the conventional vacuum-ultraviolet (VUV) angle-resolved photoemission spectroscopy (ARPES), with a probing depth of several angstroms, experiments on thin films have to use sophisticated in-situ sample transfer systems to avoid surface contamination. In this Letter, we put forward a…
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