High quality factor single-crystal diamond mechanical resonators

TL;DR

This paper presents a wafer bonding technique to create high-quality single-crystal diamond resonators with exceptional mechanical quality factors, enabling advanced MEMs and quantum device integration.

Contribution

It introduces a novel wafer bonding method for diamond on insulator, achieving record-high quality factors in micromechanical resonators.

Findings

Quality factors up to 338,000 at room temperature

Nonmonotonic temperature dependence of quality factor

Potential for integration into MEMs and quantum technologies

Abstract

Single-crystal diamond is a promising material for MEMs devices because of its low mechanical loss, compatibility with extreme environments, and built-in interface to high-quality spin centers. But its use has largely been limited by challenges in processing and growth. We demonstrate a wafer bonding-based technique to form diamond on insulator, from which we make single-crystal diamond micromechanical resonators with mechanical quality factors as high as 338,000 at room temperature. Variable temperature measurements down to 10 K reveal a nonmonotonic dependence of quality factor on temperature. These resonators enable integration of single-crystal diamond into MEMs technology for classical and quantum applications.