Planar Pixel Sensors for the ATLAS tracker upgrade at HL-LHC

TL;DR

This paper reviews the development and testing of planar pixel sensors for the ATLAS detector upgrade at HL-LHC, demonstrating their radiation hardness and operational viability through various experimental results.

Contribution

It provides new radiation study data on n-in-n and n-in-p sensors, confirming their suitability for high-radiation environments in future collider experiments.

Findings

Sensors operate effectively after high radiation doses

Tracking efficiencies remain high post-irradiation

Radiation studies validate sensor design for HL-LHC upgrade

Abstract

The ATLAS Planar Pixel Sensor R&D Project is a collaboration of 17 institutes and more than 80 scientists. Their goal is to explore the operation of planar pixel sensors for the tracker upgrade at the High Luminosity-Large Hadron Collider (HL-LHC). This work will give a summary of the achievements on radiation studies with n-in-n and n-in-p pixel sensors, bump-bonded to ATLAS FE-I3 and FE-I4 readout chips. The summary includes results from tests with radioactive sources and tracking efficiencies extracted from test beam measurements. Analysis results of ${2\cdot10^{16}} \text{n}_{\text{eq}}\text{cm}^{-2}$ and ${1\cdot10^{16}} \text{n}_{\text{eq}}\text{cm}^{-2}$ ($1 \text{MeV}$ neutron equivalent) irradiated n-in-n and n-in-p modules confirm the operation of planar pixel sensors for future applications.