Planar Pixel Sensors for the ATLAS tracker upgrade at HL-LHC
Christian Gallrapp

TL;DR
This paper reviews the development and testing of planar pixel sensors for the ATLAS detector upgrade at HL-LHC, demonstrating their radiation hardness and operational viability through various experimental results.
Contribution
It provides new radiation study data on n-in-n and n-in-p sensors, confirming their suitability for high-radiation environments in future collider experiments.
Findings
Sensors operate effectively after high radiation doses
Tracking efficiencies remain high post-irradiation
Radiation studies validate sensor design for HL-LHC upgrade
Abstract
The ATLAS Planar Pixel Sensor R&D Project is a collaboration of 17 institutes and more than 80 scientists. Their goal is to explore the operation of planar pixel sensors for the tracker upgrade at the High Luminosity-Large Hadron Collider (HL-LHC). This work will give a summary of the achievements on radiation studies with n-in-n and n-in-p pixel sensors, bump-bonded to ATLAS FE-I3 and FE-I4 readout chips. The summary includes results from tests with radioactive sources and tracking efficiencies extracted from test beam measurements. Analysis results of and ( neutron equivalent) irradiated n-in-n and n-in-p modules confirm the operation of planar pixel sensors for future applications.
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