Modeling of Deformation and Texture Development of Copper in a 120° ECAE Die

TL;DR

This paper introduces a flow line function to model deformation in ECAE with a 120° die, integrating it into a polycrystal simulation to predict texture evolution in copper, validated against experimental data.

Contribution

It presents a novel analytical flow line function for ECAE deformation modeling and incorporates it into a texture simulation framework for copper.

Findings

The model accurately predicts texture development in copper during ECAE.

Simulation results align well with experimental textures.

The approach enhances understanding of deformation mechanisms in ECAE.

Abstract

A flow line function is proposed to describe the material deformation in ECAE for a 120\degree die. This new analytical approach is incorporated into a viscoplastic self-consistent polycrystal code to simulate the texture evolution in Route A of copper and compared to experimental textures as well as to those corresponding to simple shear.