Tin Pest: A Forgotten Issue in the Field of Applied Superconductivity?
R. Pfister, and P. Pugnat
TL;DR
This paper investigates the impact of tin pest on soldered copper samples, revealing a significant strength degradation at low temperatures, which highlights a previously overlooked issue in applied superconductivity.
Contribution
It identifies tin pest as a critical factor affecting solder joint strength at cryogenic temperatures in superconductivity applications.
Findings
37% shear strength reduction at 77 K with lead-free solder
Tin pest causes significant mechanical degradation at cryogenic temperatures
Highlights need for addressing tin pest in superconducting device design
Abstract
Shear ruptures of Cu samples soldered with Sn96Ag4 and Sn60Pb40 alloys have been measured at 300 K and 77 K. An average degradation of about 37 % of the shear rupture strength has been observed at cold for samples soldered with the lead-free alloy. This effect can be attributed to the tin pest.
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Taxonomy
TopicsElectronic Packaging and Soldering Technologies · Engineering and Materials Science Studies · Aluminum Alloys Composites Properties