Characterization of new hybrid pixel module concepts for the ATLAS Insertable B-Layer upgrade
Malte Backhaus

TL;DR
This paper compares two innovative hybrid pixel module concepts, planar and 3D silicon sensors, for the ATLAS IBL upgrade, demonstrating high performance and robustness after irradiation to meet LHC requirements.
Contribution
It introduces and evaluates two new module concepts based on FE-I4 readout chips, showing their suitability for high-radiation environments in the ATLAS IBL upgrade.
Findings
Both sensor concepts achieve >97% hit efficiency after irradiation.
Modules operate effectively at low thresholds with minimal noise.
Prototype modules meet the specifications for the ATLAS IBL upgrade.
Abstract
The ATLAS Insertable B-Layer (IBL) collaboration plans to insert a fourth pixel layer inside the present Pixel Detector to recover from eventual failures in the current pixel system, especially the b-layer. Additionally the IBL will ensure excellent tracking, vertexing and b-tagging performance during the LHC phase I and add robustness in tracking with high luminosity pile-up. The expected peak luminosity for IBL is 2 to 3centerdot1034 cm-2s-1 and IBL is designed for an integrated luminosity of 700 fb-1. This corresponds to an expected fluence of 5centerdot1015 1 MeV neqcm-2 and a total ionizing dose of 250 MRad. In order to cope with these requirements, two new module concepts are under investigation, both based on a new front end IC, called FE-I4. This IC was designed as readout chip for future ATLAS Pixel Detectors and its first application will be the IBL. The planar pixel sensor…
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