Further Developments in Gold-stud Bump Bonding

TL;DR

This paper discusses recent advancements and challenges in gold-stud bonding techniques, including double gold-stud and 0.5 mil wire bonding, to improve interconnect reliability in high energy physics detectors.

Contribution

It introduces new developments in gold-stud bonding methods, analyzing their advantages, limitations, and optimized procedures for complex silicon detector assembly.

Findings

Double gold-stud bonding shows improved reliability.

0.5 mil wire gold-stud bonding enables finer interconnects.

Optimized parameters enhance bonding quality.

Abstract

As silicon detectors in high energy physics experiments require increasingly complex assembly procedures, the availability of a wide variety of interconnect technologies provides more options for overcoming obstacles in generic R&D. Gold ball bonding has been a staple in the interconnect industry due to its ease of use and reliability. However, due to some limitations in the standard technique, alternate methods of gold-stud bonding are being developed. This paper presents recent progress and challenges faced in the development of double gold-stud bonding and 0.5 mil wire gold-stud bonding at the UC Davis Facility for Interconnect Technology. Advantages and limitations of each technique are analyzed to provide insight into potential applications for each method. Optimization of procedures and parameters is also presented.