Development of Readout Interconnections for the Si-W Calorimeter of SiD
M. Woods, R. G. Fields, B. Holbrook, R. L. Lander, A. Moskaleva, C., Neher, J. Pasner, M. Tripathi, J. E. Brau, R. E. Frey, D. Strom, M., Breidenbach, D. Freytag, G. Haller, R. Herbst, T. Nelson, S. Schier, B., Schumm
TL;DR
This paper reviews interconnection technologies for the Si-W calorimeter of SiD, highlighting solder ball bonding as a promising method for attaching silicon wafers to readout flex cables in collider detectors.
Contribution
It provides an overview of bonding techniques and demonstrates solder ball bonding as a viable solution for detector module assembly.
Findings
Solder ball bonding shows promise for Si-W ECAL interconnections.
Surface preparation and solder selection are critical for bond quality.
Unresolved issues are being actively addressed.
Abstract
The SiD collaboration is developing a Si-W sampling electromagnetic calorimeter, with anticipated application for the International Linear Collider. Assembling the modules for such a detector will involve special bonding technologies for the interconnections, especially for attaching a silicon detector wafer to a flex cable readout bus. We review the interconnect technologies involved, including oxidation removal processes, pad surface preparation, solder ball selection and placement, and bond quality assurance. Our results show that solder ball bonding is a promising technique for the Si-W ECAL, and unresolved issues are being addressed.
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