Modeling and simulation of ion energy distribution functions in technological plasmas

TL;DR

This paper reviews the modeling and simulation techniques for ion energy distribution functions in technological plasmas, emphasizing their importance in surface treatment processes like etching and deposition.

Contribution

It provides a comprehensive overview of IEDF modeling approaches, from simplified models to self-consistent plasma simulations, and discusses control strategies.

Findings

Summarizes fundamental IEDF modeling concepts

Highlights the progression from simplified to self-consistent models

Discusses methods for controlling IEDF in plasma processes

Abstract

The highly advanced treatment of surfaces as etching and deposition is mainly enabled by the extraordinary properties of technological plasmas. The primary factors that influence these processes are the flux and the energy of various species, particularly ions, that impinge the substrate surface. These features can be theoretically described using the ion energy distribution function (IEDF). The article is intended to summarize the fundamental concepts of modeling and simulation of IEDFs from simplified models to self-consistent plasma simulations. Finally, concepts for controlling the IEDF are discussed.