Test Beam Results of 3D Silicon Pixel Sensors for the ATLAS upgrade

TL;DR

This paper reports beam test results of 3D silicon pixel sensors designed for the ATLAS upgrade, demonstrating their charge collection, efficiency, and charge sharing capabilities under various conditions, including magnetic fields.

Contribution

It presents novel beam test results of full 3D and double-sided 3D silicon pixel sensors with active edges for the ATLAS upgrade.

Findings

Sensors showed good charge collection and tracking efficiency.

Full 3D and double-sided sensors had comparable performance.

Performance was tested under magnetic field conditions.

Abstract

Results on beam tests of 3D silicon pixel sensors aimed at the ATLAS Insertable-B-Layer and High Luminosity LHC (HL-LHC)) upgrades are presented. Measurements include charge collection, tracking efficiency and charge sharing between pixel cells, as a function of track incident angle, and were performed with and without a 1.6 T magnetic field oriented as the ATLAS Inner Detector solenoid field. Sensors were bump bonded to the front-end chip currently used in the ATLAS pixel detector. Full 3D sensors, with electrodes penetrating through the entire wafer thickness and active edge, and double-sided 3D sensors with partially overlapping bias and read-out electrodes were tested and showed comparable performance.