Phonon Transport in Suspended Single Layer Graphene
Xiangfan Xu, Yu Wang, Kaiwen Zhang, Xiangming Zhao, Sukang Bae, Martin, Heinrich, Cong Tinh Bui, Rongguo Xie, John T. L. Thong, Byung Hee Hong, Kian, Ping Loh, Baowen Li, Barbaros Oezyilmaz

TL;DR
This study measures how heat is conducted by phonons in suspended single-layer graphene across a wide temperature range, revealing a peak near 280K and highlighting the role of flexural phonons.
Contribution
First temperature-dependent phonon transport measurements in suspended Cu-CVD graphene from 15K to 380K, clarifying thermal conductance behavior and phonon contributions.
Findings
Thermal conductance peaks near 280K due to Umklapp process.
At low T, thermal conductivity scales as T^{1.5}.
Thermal conductance approaches ballistic limit for graphene.
Abstract
We report the first temperature dependent phonon transport measurements in suspended Cu-CVD single layer graphene (SLG) from 15K to 380K using microfabricated suspended devices. The thermal conductance per unit cross section /A increases with temperature and exhibits a peak near T~280K (10K) due to the Umklapp process. At low temperatures (T<140K), the temperature dependent thermal conductivity scales as ~T^{1.5}, suggesting that the main contribution to thermal conductance arises from flexural acoustic (ZA) phonons in suspended SLG. The /A reaches a high value of 1.7 W/m^2K, which is approaching the expected ballistic phonon thermal conductance for two-dimensional graphene sheets. Our results not only clarify the ambiguity in the thermal conductance, but also demonstrate the potential of Cu-CVD graphene for heat related applications.
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Taxonomy
TopicsThermal properties of materials · Graphene research and applications · Silicon Carbide Semiconductor Technologies
