Phase separation in thermal systems: LB study and morphological characterization

TL;DR

This study uses a FFT-TLB model to compare thermal and isothermal liquid-vapor phase separations, revealing how temperature influences morphology, kinetics, and domain growth, with thermal systems showing slower coarsening and different structures.

Contribution

It introduces a detailed analysis of thermal phase separation using FFT-TLB, highlighting the effects of temperature on morphology and growth dynamics, which were not thoroughly explored before.

Findings

Thermal phase separation prolongs the SD stage compared to isothermal.

Thermal systems exhibit lower domain growth exponents than isothermal systems.

Thermal separation results in scattered bubbles, while isothermal favors bicontinuous structures.

Abstract

We investigate thermal and isothermal symmetric liquid-vapor separations via a FFT-Thermal Lattice Boltzmann (FFT-TLB) model. Structure factor, domain size and Minkowski functionals are employed to characterize the density and velocity fields as well as to understand the configurations and the kinetic processes. Compared with the isothermal phase separation, the freedom in temperature prolongs the Spinodal Decomposition (SD) stage and induces different rheological and morphological behaviors in the thermal system. After the transient procedure, both the thermal and isothermal separations show power-law scalings in domain growth; while the exponent for thermal system is lower than that for isothermal system. With respect to the density of field, the isothermal system presents more likely bicontinuous configurations with narrower interfaces, while the thermal system presents more likely configurations with scattered bubbles. Heat creation, conduction and lower interfacial stresses are main reasons for the differences in thermal system. Different from the case with isothermal phase separation, the release of latent heat causes the changing of local temperature which results in new local mechanical balance. When the Prandtl number becomes smaller, the system approaches thermodynamical equilibrium more quickly. The increasing of mean temperature makes lower the interfacial stress in the following way: $\sigma=\sigma_{0}[(T_{c}-T)/(T_{c}-T_{0})]^{3/2}$, where $T_{c}$ is the critical temperature and $\sigma_{0}$ is the interfacial stress at a reference temperature $T_{0}$, which is the main reason for lower growth exponent in thermal case.