Opportunities and challenges in the use of heavily doped polycrystalline silicon as a thermoelectric material. An experimental study
Dario Narducci, Ekaterina Selezneva, Gianfranco Cerofolini, Elisabetta, Romano, Rita Tonini, and Giampiero Ottaviani

TL;DR
This experimental study demonstrates that heavily doped polycrystalline silicon films can achieve high thermoelectric power factors after thermal annealing, suggesting a promising low-cost material for thermoelectric devices.
Contribution
The paper shows that annealed heavily doped polycrystalline silicon exhibits significantly improved thermoelectric properties, surpassing previous nanowire results, indicating potential for practical thermoelectric applications.
Findings
Power factor of 13 mW K$^{-2}$ m$^{-1}$ at 1000°C annealing
Enhanced Seebeck coefficient due to boron dissolution
Potential for low-cost thermoelectric devices
Abstract
Large-volume deployment of Si-based Seebeck generators can be foreseen only if polycrystalline rather than single crystalline materials can be actually used. The aim of this study was therefore to verify whether polycrystalline Si films deposited on top of a SiO insulating layer can develop interesting thermoelectric power factors. We prepared 450-nm thick heavily boron doped polysilicon layers, setting the initial boron content in the film to be in excess of the boron solubility in polycrystalline silicon at 1000 {\deg}C. Isochronal thermal annealings were then used to modify the B content by precipitation. Quite unexpectedly, a concurrent increase of the thermoelectric power and of the conductivity was observed for heat treatments at temperatures above 800 {\deg}C. Upon annealing at 1000 {\deg}C we found a power factor of 13 mW K m, more than three times…
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Taxonomy
TopicsAdvanced Thermoelectric Materials and Devices · Thermal properties of materials · Thermal Radiation and Cooling Technologies
