Thermal conductivity of diamond-loaded glues for the ATLAS particle physics detector
E. A. Ouellette, A. Harris

TL;DR
This paper investigates the thermal conductivity of diamond-loaded glues to improve heat dissipation in the ATLAS detector's Insertable B-Layer, using a modified transient plane source technique across various temperatures.
Contribution
It introduces measurements of diamond-loaded glues' thermal conductivity for particle detector applications, employing a modified transient plane source method.
Findings
Diamond-loaded glues exhibit high thermal conductivity.
Temperature affects the thermal conductivity of the glues.
The modified transient plane source technique effectively characterizes the glues.
Abstract
The ATLAS experiment is one of two large general-purpose particle detectors at the Large Hadron Collider (LHC) at the CERN laboratory in Geneva, Switzerland. ATLAS has been collecting data from the collisions of protons since December 2009, in order to investigate the conditions that existed during the early Universe and the origins of mass, and other topics in fundamental particle physics. The innermost layers of the ATLAS detector will be exposed to the most radiation over the first few years of operation at the LHC. In particular, the layer closest to the beam pipe, the B-layer, will degrade over time due to the added radiation. To compensate for its degradation, it will be replaced with an Insertable B-Layer (IBL) around 2016. The design of and R&D for the IBL is ongoing, as the hope is to use the most current technologies in the building of this new sub-detector layer. One topic of…
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Taxonomy
TopicsParticle Detector Development and Performance · Silicon Carbide Semiconductor Technologies · Superconducting Materials and Applications
