Thermodynamics and analysis of rate-independent adhesive contact at small strains

TL;DR

This paper develops and analyzes a thermodynamically consistent model for rate-independent adhesive contact involving heat-conductive viscoelastic bodies with thermal expansion, focusing on existence of weak solutions.

Contribution

It introduces a novel rate-independent debonding flow rule within a thermodynamically consistent framework for heat-conductive viscoelastic contact.

Findings

Existence of weak solutions established

Model captures thermal and mechanical coupling effects

Provides a rigorous mathematical foundation for adhesive contact analysis

Abstract

We address a model for adhesive unilateral frictionless Signorini-type contact between bodies of heat-conductive viscoelastic material, in the linear Kelvin-Voigt rheology, undergoing thermal expansion. The flow-rule for debonding the adhesion is considered rate-independent and unidirectional, and a thermodynamically consistent model is derived and analysed as far as the existence of a weak solution is concerned.